豐羅E-Solder-3022雙組分銀膠

typicalapplications of e-solder 3022 are lead terminations, printedcircuits and shielding on bases which will not withstand theelevated temperatures required for fired-on coatings or solders.e-solder 3022 is an epoxy silver paste recommended for applicationsre low electrical resistance and good adhesive properties.e-solder 3022 requires the addition of hardener no. 18 to hardenand cure. e-solder 3022 may be cured at room temperature, howeverthe application of heat will accelerate and shorten the curetime
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e-solder 3022的典型應(yīng)用是引線端接、印刷電路和底座上的屏蔽，它們不能承受燒制涂層或焊料所需的高溫。e-solder3022 是一種環(huán)氧銀漿，推薦用于需要低電阻和良好粘合性能的應(yīng)用。e-solder3022 需要添加 18 號(hào)硬化劑來(lái)硬化和固化。e-solder3022 可在室溫下固化，但加熱會(huì)加速并縮短固化時(shí)間.
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